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home > applications > thermal management solutions > transtherm thermally/electrically conductive adhesive

TransthermŽ Thermally/Electrically Conductive Adhesive



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TransthermŽ Thermally/Electrically Conductive Adhesive is an acrylic based pressure sensitive adhesive with tailor-made ceramic particles that provide superior thermal performance with no curing required.

Features
  • Low thermal resistance with selected ceramic filler
  • Thermally conductive or electrically & thermally conductive versions available
  • High insulation version available (>5 KV)
  • Easy to handle, easy to assemble
  • Single sided or double sided pressure sensitive adhesive to replace mechanical fasteners
  • Supported (Al, Kapton carrier) and unsupported versions available in various thickness

Applications
  • Heat sink to imaging ICs, GPU, DRAM chip, ADSL chip, etc.
  • Power conversion - power IC to heat sink
  • Consumable Electronics - PDPs, or LCD-TVs
  • Heat sink attachment to plastic molded/BGA packages on PCBA


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