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TransthermŽ Phase Change Materials offer very low thermal impedance for thin bondline applications. Self tacky version offers improved product handling and no pump out issue.
Features
- Phase Change temperature: 60°C
- Controlled thixotropicity eliminates migration
- Easy to handle, easy to assemble
- Chemically Resistant
- Supported (Al, Kapton carrier) and unsupported versions available in various thicknesses
- Reworkable and non-reworkable versions available
- Tacky and tack-free versions available
Applications
- CPU to heat sink
- Power modules to heat sink
- IGBT's
- DC to DC converters
- RF components
- MOSFET's
- Bridge rectifiers
- Power conversion
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